Semiconductor companies are working with universities to custom-build engineering curricula so new hires can hit the ground ...

Researchers from Virginia Tech and University of Pennsylvania found a way to create soft, flexible electric connections ...

California SiC factory funding; IEDM announcements, including 2nm and 2D materials advances from Intel and TSMC, CFETs, and ...

In-memory compute; chiplet interconnect issues; software for shift left; aging and complexity in analog design; connecting AI/HPC chips; PCle and CXL; reset tree design; testing chiplets; NPUs.

Comprehensive testing is needed to ensure that chiplet systems can withstand extreme conditions.

Efficiently connecting the multiple CPUs and accelerators, various switches, and numerous NICs in modern data centers.

As the demand for AI and machine learning accelerates, the need for faster and more flexible data interconnects has never ...

Errors within a reset tree can lead to serious issues, including metastability, glitches, and functional failures.

The LLM component of multimodal models has the same general transformer architecture. The connector in LLaVA is a ...

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second ...

As computational capabilities continue to evolve, integrating advanced grid interpolation techniques like the dual-grid ...

For example, there is more than one way to move data across a fixed distance. In some cases, this could involve a pre-built, ...