NS Naontech engineers have been taking careful measurements of ambulance interiors and finding appropriate placements for the ...
Power Integrations has introduced a wide-creepage package option for its InnoSwitch3-AQ flyback switcher IC for automotive ...
Compound Semiconductorâ„¢ is an Angel Business Communications publication.
Under the agreement, the United States would support Bosch’s investment of $1.9 billion to modernise its SiC manufacturing ...
The US Department of Commerce has issued funding awards to GlobalWafers and its subsidiaries of up to $406 million under the ...
The Fraunhofer Institute for Applied Solid State Physics IAF is expanding its III-V capabilities as a contribution to the €730 million APECS ( Advanced Packaging and Heterogeneous Integration for ...
Quantum Science’s INFIQ lead-free QDs demonstrate unparalleled performance in short-wave infrared (SWIR) sensing, reaching a ...
Researchers from University of Science and Technology of China (USTC) have developed a 2 kV/0.45 mΩ·cm 2 vertical GaN PiN ...
X-FAB Silicon Foundries has launched XSICM03, its next-generation XbloX platform, advancing SiC process technology for power ...
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