Abstract: A novel series-fed comb-array antenna with microbumps based on high resistivity silicon (HRSi) is proposed for sub-Terahertz (THz) applications. The proposed antenna consists of eight ...
Abstract: A Ku-K dual-band antenna array is proposed for antenna-in-package beamforming applications, comprising eight subarrays integrated on an interposer board using ball-grid-array (BGA) packaging ...
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