Amtech Systems, Inc. ("Amtech") , a manufacturer of equipment and consumables for semiconductor fabrication and packaging, today announced the appointment of Asif Y. Jakwani to its Board of Directors.
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
Summary The chip industry saw major 2024 investments in SiC, GaN, DRAM, and advanced packaging facilities, fueled by government support like CHIPS Act funding. Amkor's $2B Arizona project exemplifies ...
JBT Proseal installed its 8000th tray sealing machine with customer Bakkavor, marking the transition from the F-series to the ...
TAICHUNG, Taiwan : Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday ...
(Reuters) - The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.
B&R's Safety+ is an open approach to safety programming, allowing developers to use standard software engineering tools while ...
[File photo: Reuters/Florence Lo] The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.
Investing.com -- Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC), its main contract chipmaker, although the ...
TAICHUNG, Taiwan (Reuters) - Nvidia (NASDAQ:NVDA)'s demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen ...