XbloX is a streamlined business process and technology platform designed to accelerate the development of advanced SiC MOSFET ...

The global tech industry has faced substantial layoffs in 2024, with approximately 150,000 jobs eliminated by companies.

Core teams up with Sarcina, who have designed a custom package specifically for use at cryogenic temperatures.

Microchip Technology has unveiled a new family of ATA650x CAN FD System Basis Chips (SBCs). These chips combine a fully ...

Nordic Semiconductor and Kigen, a developer of eSIM security solutions for the IoT, have announced a technical collaboration ...

G work is dominated by research but over the next two years the balance will shift from research to commercialisation.

Rapidus has announced a collaboration with Cadence to provide co-optimised AI-driven reference design flows and IP.

NXP and geo, a provider of residential energy management solutions, develop Matter enabled smart energy solution.

Organisations are finding out the hard way how much storing long-term data in the cloud costs, so what's the solution?

HaLowLink 1 is a reference-designed Wi-Fi HaLow Access Point, expanding Morse Micro's suite of IoT evaluation tools.

Wire bonding is a critical yet often overlooked process in electronics manufacturing, but plays an indispensable role.

At 2024 IEDM, imec and its partners within the Q-COMIRSE project (Ghent University, QustomDot BV, ChemStream BV and ams OSRAM ...