At 2024 IEDM, imec and its partners within the Q-COMIRSE project (Ghent University, QustomDot BV, ChemStream BV and ams OSRAM ...

Nordic Semiconductor and Kigen, a developer of eSIM security solutions for the IoT, have announced a technical collaboration ...

ECSN projects a return to growth for the electronics components market in 2025 after a very weak performance in 2024.

Wire bonding is a critical yet often overlooked process in electronics manufacturing, but plays an indispensable role.

G work is dominated by research but over the next two years the balance will shift from research to commercialisation.

u-blox has introduced an ultra-low power GNSS chip that represents a major advance in compact and efficient positioning ...

Organisations are finding out the hard way how much storing long-term data in the cloud costs, so what's the solution?

Rapidus has announced a collaboration with Cadence to provide co-optimised AI-driven reference design flows and IP.

NXP and geo, a provider of residential energy management solutions, develop Matter enabled smart energy solution.

HaLowLink 1 is a reference-designed Wi-Fi HaLow Access Point, expanding Morse Micro's suite of IoT evaluation tools.

Google claims to have overcome a key challenge in quantum computing with the unveiling of a new generation of chip.

Ayar Labs, a leading developer of optical interconnect solutions for large-scale AI workloads, has secured $155 million.