Electronics engineers are evaluating novel techniques for transfer printing, wiring, and additive manufacturing.

Kioxia and Nanya Technology have co-developed a type of 4F2 DRAM known as Oxide-Semiconductor Channel Transistor DRAM (OCTRAM ...

Kyocera AVX has expanded its CR series of high-power chip resistors with a device that handles 2.5 W in a small 0603 package.

U2’s 0 to -10 V output is inverted by the Q2, Q3, and Q4 differential amplifier via feedback to U3’s ADJ input, forcing U3 to ...

Microchip’s MTCH2120 turnkey touch controller offers 12 capacitive touch sensors configured via an I 2 C interface. Backed by ...

Elections, geopolitical tensions and AI…oh my! Read on for our intrepid engineer’s latest set of predictions (or, at minimum, ...

The new leadership at Samsung's foundry division aims to streamline GAA technology and its yield at 2-nm process node.

The Certus 9704 IoT module from Iridium supports satellite IoT applications requiring real-time data analysis and automated ...

An XPU comprises four layers: compute, memory, network I/O, and reliable packaging technology. Industry watchers call XPU the ...

Here is a short tutorial on why DC/DC buck converters need capacitors on the input and how it works in a power design.

Adaptive SoCs in AMD’s Versal RF series integrate direct RF sampling data converters, dedicated DSP hard IP, and AI engines ...

When designing space electronics, the oscilloscope verifies the timing and quality of signals, but how can you choose the ...