To dramatically increase coral survival rates, scientists at the University of Hawaiʻi at Mānoa Hawaiʻi Institute of Marine ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: In this paper, the authors propose a novel sensing technique for Structural Health Monitoring (SHM) based on the use of an array of magnetic field sensors to detect three-dimensional ...
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