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New Thermal Paste Could Supercharge Chip Cooling
Scientists at the University of Texas Austin Cockrell School of Engineering say they have developed a thermal material that ...
Yahoo
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New Thermal Paste Could Change Chip Cooling
TIMs generally sit between a processor and the heat sink to help pull heat away from the chip. Using mechanochemistry, the ...
Hosted on MSN
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New Liquid Metal Tech Outperforms Existing Solutions by 72%
The researchers achieved a remarkable feat by combining the liquid metal with ceramic particles using a process known as ...
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