Lasers can investigate magnetism in non-magnetic metals and assess control of ultra-thin semiconductors using pulses of ...

Called the Vector TEOS 3D, Lam said the tool will be required for applications like AI and high-performance computing (HPC) ...

Your AI might look smart on benchmarks but could be brittle in the real world, leading to unexpected failures and eroding ...

Major companies are turning to classrooms to help solve real-world business challenges through a new 3DE learning model.

Interstellar objects like 3I/ATLAS that have been captured in planet-forming disks around young stars could become the seeds ...

The iridescent blue of butterfly wings has inspired researchers to find a solution to a challenge previously considered ...

TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence and high-performance computing applications.

A new technical paper titled “Analog optical computer for AI inference and combinatorial optimization” was published by ...

This study introduces a dual approach using vertical SAXS and optical microscopy to monitor nanoparticle self-assembly, ...