Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
Abstract: In this letter, we first investigate a shift strategy for enhancing the length of the consecutive segment in the sum and difference co-array (SDCA). Then, a fourth-order sparse antenna array ...
The model, called SHARP, can reconstruct a photorealistic 3D scene from a single image in under a second. Here are some examples. Apple has published a study titled Sharp Monocular View Synthesis in ...
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