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Electric-field-assisted assembly enables scalable, lithography-free fabrication of logic circuits using 2D semiconductors. It ...
Tech Xplore on MSN
New chip design cuts AI energy use by enabling smarter FPGA processing
A new innovation from Cornell researchers lowers the energy use needed to power artificial intelligence—a step toward ...
A new technical paper titled “Towards An Approach to Identify Divergences in Hardware Designs for HPC Workloads” was ...
Optimization Pathways for Long-Context Agentic LLM Inference” was published by researchers at University of Cambridge, ...
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