The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

New York Gov. Kathy Hochul announced on Friday that semiconductor manufacturer GlobalFoundries will be creating a new center ...

GlobalFoundries (GFS) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New ...

The funds will enable new technologies to be validated and transitioned at scale.

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.

The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and risks. While in the past the trend was toward more and more integration on a ...

Advanced packaging plays a vital role in semiconductors, such as High Bandwidth Memory, or HBM, which stacks DRAM chips and packaging, among other things, transforms DRAMs into HBMs. HBMs along ...

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...