Nvidia transitions to advanced CoWoS-L chip packaging, signaling a major shift for TSMC
Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang ...
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SK Hynix considers 2.5D packaging business with Amkor
Summary SK Hynix is teaming up with Amkor to enter the OSAT market, fueled by $958 million in CHIPS Act funding. The company ...
Computer chip packaging and testing center comes to New York
New York Gov. Kathy Hochul announced on Friday that semiconductor manufacturer GlobalFoundries will be creating a new center ...
Federal funding boosts US chip packaging with $1.4B in CHIPS Act awards
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
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GlobalFoundries to build new chip packaging center
GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.
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GlobalFoundries to create New York Advanced Packaging and Photonics Center
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an ...
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Taiwan takes a further step in production of AI chips with advanced new plant
Taiwan took another step in enhancing its key role in the production of advanced semiconductor chips used for artificial ...