Federal funding boosts US chip packaging with $1.4B in CHIPS Act awards
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
GlobalFoundries to build advanced packaging center in Malta, NY
New York Gov. Kathy Hochul announced on Friday that semiconductor manufacturer GlobalFoundries will be creating a new center ...
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Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
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GlobalFoundries to build new chip packaging center
GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.
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GlobalFoundries to open advanced chip packaging center in New York
Governor Kathy Hochul announced that GlobalFoundries will invest $575 million to establish the New York Advanced Packaging ...
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GlobalFoundries to create New York Advanced Packaging and Photonics Center
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an ...