Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang ...

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.

Governor Kathy Hochul announced that GlobalFoundries will invest $575 million to establish the New York Advanced Packaging ...

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...

GlobalFoundries (GFS) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New ...

Chip packaging technology is one of the main keys, and TSMC also dominates in that section. That said, Qualcomm could shake the foundations of the industry by depending less on TSMC’s advanced ...

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...