M31 Technology held an investor conference (March 19) and announced consolidated revenue of NT$1.48 billion for the full year ...

EnSilica is pleased to announce that it has been awarded a multimillion-pound design and manufacturing services contract by a ...

We are thrilled to announce that Cadence has successfully demonstrated first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry's ...

A new, comprehensive, end-to-end debug & trace solution for RISC-V based SoCs, Tessent UltraSight-V is specifically designed ...

Brite Semiconductor today announced the launch of DDR3/4, LPDDR3/4 Combo IP. Developed on 28HKD 0.9V/2.5V platform, this IP has extensive protocol compatibility, supporting DDR3, DDR3L, DDR4 and ...

FlexGen, a network-on-chip (NoC) interconnect IP, is aiming to accelerate SoC creation by leveraging AI.

Zero ASIC, a U.S. semiconductor startup on a mission to democratize silicon, has announced Platypus, the world’s first ...

Unprecedented growth and demand for edge computing and high-performance computing (HPC) is creating new opportunities and significant challenges for custom chips. We spoke to Sondrel CEO Oliver Jones ...

MediaTek and TSMC (TWSE: 2330, NYSE: TSM) announced today that they have jointly demonstrated the first silicon-proven power ...

Introduction As technology progresses, the rise of quantum computing brings both exciting opportunities and serious ...

The 32G UCIe IP, supporting UCIe 2.0, delivers an impressive bandwidth density of 10 Tbps per 1 mm of die edge (5 Tbps/mm ...

Menta eFPGA Inc. has initiated a new IP access program called Launch Pad for its acclaimed embedded FPGA (eFPGA) ...