Logic semiconductor manufacturers plan to replace FinFET devices with Gate All Around at sub-3nm nodes. Applied Materials has introduced a complex seven chamber system with Atomic Layer Deposition as ...
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Light yet strong material inspired by egg whites can cool devices faster
A research team at the Korea Institute of Materials Science (KIMS) has developed a high-performance heat-dissipating ...
SAN JOSE, Calif., Feb. 26, 2024 (GLOBE NEWSWIRE) -- Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to ...
Applied Materials said it plans to invest up to $4 billion in a new research hub in the heart of Silicon Valley, in a bid to bring new innovations in process technology to market faster. The facility ...
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