The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Lead-free solder has numerous undesirable characteristics, such as a higher melting point and reduced wetting than its leaded predecessor. These characteristics tend to produce more voids in solder ...