SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...
This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
SAN FRANCISCO — The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) here today announced that it will install a 300-mm wafer-level packaging line at Unitive Inc.'s subsidiary in ...
From powering watches to phones, handheld consoles to desktop PCs, office servers to data centers, processors can be found everywhere and in every size possible. That last aspect is set to take a ...
Incorporating the NanoResolution MRS sensor, the WX3000 Metrology and Inspection systems enable the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced ...
BENGALURU, India, Oct. 21, 2025 /PRNewswire/ -- Fan-Out Wafer Level Packaging Market is Segmented by Type (High Density Fan-Out Package, Core Fan-Out Package), by Application (CMOS Image Sensor, A ...
LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Dr. Navid Asadi’s group takes a look at wafer to panel level chip packaging. This is the six of a mutlipart series on chip packaging technologies. Navid Asadi is an assistant professor in the ...
Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
And all because the tech world just can't get enough processing power. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. Add us as a preferred ...
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