NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
New CC2340 Series Family — CC2340R5 Bluetooth 5.3 Low Energy Modules RF-BM-2340B1I, RF-BM-2340A2, RF-BM-2340A2I and RF-BM-2340C2 Are In Stock Now! SHENZHEN ...
Empower RF Systems has announced the release of its latest C-UAS RF amplifier module, Model 1211, engineered for robust ...
Tessera Inc. today will introduce chip-scale packaging technology the company claims provides performance, size, and cost advantages for designers of RF modules used in wireless products. Tessera's ...
It's our hope that products such as these will inspire you to create your own new offerings. Dracula Tech's next-gen light ...
RF Digital has released a fully FCC and CE-compliant 2.4GHz ULP wireless module in 15 by 15 by 3mm form factor powered by the nRF24LE1 ultra low power single chip transceiver, from wireless specialist ...
TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new NanoRF modules and contacts, which ...
Pickering Interfaces, a supplier of modular signal switching and simulation solutions for electronic test and verification, has introduced a number of new integrated PXI RF matrix modules with a 32x8 ...
Mouser Electronics, Inc. has released a new eBook that delves into key radio frequency (RF) design topics ranging from signal ...
Module technology, including system-in-a-package (SiP) and multi-chip modules (MCMs), is creating attractive alternatives to the system-on-a-chip (SoC) design methodology for systems that require ...
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