New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.
Texas Instruments Inc. (TI) announced several power management devices and a reference design to help companies meet AI computing demands and scale power management architectures from 12 V to 48 V to ...
SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a ...
SHENMAO America, Inc. is proud to announce the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates. This no-clean, halogen-free solder ...
Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.
More efficient, smaller, and lighter traction inverters for EVs can be created by integrating current sensors directly into SiC-based power modules. Silicon Austria Labs (SAL), a power semiconductor ...
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