Running a warehouse isn’t a walk in the park. Between juggling inventory, coordinating team members, and trying to stay ahead of orders, it can feel like there’s always a fire to put out. But one of ...

As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and reliable physical layout modification grows more critical. Meeting these ...

The objective of the 3D-SCALO problem is to assign the given components to optimal mounting surfaces and position them at the best locations, while satisfying the requirements for (1) heat dissipation ...

For the difference of rock and soil strength on the tunneling face, curved tunneling, and the top-heavy structure of the main machine forming the complex geological structure, the adoption of uniform ...

Suggested Citation: "4 Topology Optimization and Multi-Physics." National Academies of Sciences, Engineering, and Medicine. 2022. Exploiting Advanced Manufacturing Capabilities: Topology Optimization ...

Modern semiconductor chip design faces growing complexity due to numerous timing scenarios driven by varying operating conditions and physical effects. This complexity is especially pronounced in ...