The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...

When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. Table 1. 4:2:2 component digital format sampling frequencies. Click here to see an enlarged ...

The world’s biggest chipmakers are coming together to create a new Universal Chiplet Interconnect Express (UCIe) system for integrating chiplets together in future semiconductor designs. Virtually ...

Active filters are ubiquitous in electronic design today, performing signal-frequency manipulation and conditioning for audio, IF (intermediate frequency), and digital-signal processing. The success ...

The ever-increasing integration of digital processes in manufacturing is one of the main revolutions the industry is witnessing. Marcus Schneck, CEO of norelem, addresses how data and standard ...