Semiconductor packaging is essential to the performance, reliability, and thermal management of modern electronic devices. As ...
The latest edition of the multiphysics simulation magazine, COMSOL News 2026, features stories from users across a variety of ...
BURLINGTON, MA, April 17, 2025 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, announced the program for its COMSOL Day: Simulation Apps & Digital Twins event ...
Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...
Register by 24 July to secure the early bird rate for the COMSOL Conference 2026 Cambridge and save on your conference ...
COMSOL version 6.0 delivers performance improvements and simplifies simulation of many important applications, such as printed circuit board (PCB) design (pictured). COMSOL Inc. (Burlington, Mass., ...
COMSOL has introduced Version 4.3a of COMSOL Multiphysics®, its flagship software for modeling and simulating physics-based systems. With version 4.3a and in response to user requests, COMSOL ...
Thermal management factors in to the design of all electronic devices. When it comes to the thermal management of devices, engineering objectives primarily involve efficiency, safety, reliability, ...
Comsol has upgraded its CAD simulation platform which now includes five new application-specific modules and expanded modeling and analysis tools. This includes the multibody dynamics module used to ...
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