Moreover, additional attack possibilities arise during the assembly process. In advanced packaging, several components are connected together, which increases the risk of tampering or unauthorized ...

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center.

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang ...

Samsung Electronics (OTCPK:SSNLF) is planning to reorganize its supply chain for advanced semiconductor ... or AI accelerators process large amounts of data, and packaging is vital in connecting ...

This technique relies on a rapid layer-by-layer laser-induced melting and fusion process, effectively ... pressing ...

Additionally, Elephantech has released the ELP04-PILOT, a compact inkjet system for advanced packaging processes. The system is designed to support materials development and process optimization ...

with rumors swirling that they'll use TSMC's advanced N3P process node, and server-grade SoIC advanced packaging. In a new post to X by insider Ming-Chi Kuo, we're learning that Apple's next-gen ...

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...